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BS EN 60191-6-13:2016 BSl Standards Publication Licensed copy:IPLogin,TheUniversityofBath,Versioncorrectas Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) bsi. BRITISH STANDARD BSEN60191-6-13:2016 National foreword This British Standard is the UK implementation of EN 60191-6-13:2016. It is identical to IEC 60191-6-13:2016. It supersedes BS EN 60191-6-13:2007 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2016. Published by BSI Standards Limited 2016 ISBN 978 0580 83163 8 ICS 31.080.01 Compliance with a British Standard cannot confer immunity from legal obligations. This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 December 2016. Amendments/corrigenda issued since publication Date Text affected BSEN60191-6-13:2016 EUROPEANSTANDARD EN 60191-6-13 NORME EUROPEENNE EUROPAISCHE NORM November 2016 ICS 31.080.01 Supersedes EN 60191-6-13:2007 English Version , Version correct as of 27/02/2017 Mechanicalstandardizationof semiconductordevices Part 6-13: Design guideline of open-top-type sockets for Fine pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) Normalisation mecanique des dispositifs a semiconducteurs Mechanische Normung von Halbleiterbauelementen - - Partie 6-13: Guide de conception pour les supports sans Teil 6-13: Konstruktionsleitfaden fur Open-top-Fassungen fur Feinraster-Ball-Grid-Array und Feinraster-Land-Grid- couvercle pour les boitiers matriciels a billes et a pas fins (FBGA) et ies boitiers matriciels a zone de contact plate et Array (FBGA/FLGA) a pas fins (FLGA) (IEC 60191-6-13:2016) (IEC 60191-6-13:2016) , The University of Bath, This European Standard was approved by CENELEC on 2016-11-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre ortoany CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. CENELEC European CommitteeforElectrotechnical Standardization Comite Europeen de Normalisation Electrotechnique Europaisches Komitee fuir Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any formand by any means reserved worldwidefor CENELEC Members. Ref.No.EN 60191-6-13:2016 E

.pdf文档 IEC 60191-6-13 2016 Mechanical standardization of semiconductor devices - Part 6-13 Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA

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IEC 60191-6-13 2016 Mechanical standardization of semiconductor devices - Part 6-13 Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA 第 1 页 IEC 60191-6-13 2016 Mechanical standardization of semiconductor devices - Part 6-13 Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA 第 2 页 IEC 60191-6-13 2016 Mechanical standardization of semiconductor devices - Part 6-13 Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA 第 3 页
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