IEC IEC61189-5-2 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME NTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies Methodes d'essai pour les materiaux électriques, les cartes imprimees et autres structuresd'interconnexionetensembles Partie 5-2: Methodes d'essai generales pour les materiaux et les assemblages- Fluxdebrasagepourlesassemblagesdecartes imprimees EC 61189-5-2:2015-01(en-fi THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright@2015IEC,Geneva,Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC copyright or have an engquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. et les microfilms, sans I'accord écrit de I'IEC ou du Comite national de I'EC du pays du demandeur. Si vous avez des questions sur le copyright de IEC ou si vous desirez obtenir des droits supplementaires sur cette publication, utilisez les coordonnées ci-apres ou contactez le Comite national de IEC de votre pays de résidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varembé Fax: +41 22 91903 00 CH-1211 Geneva 20
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